nTessimal

Redefining microelectronics with nanoparticle integration

nTessimal builds novel nanoparticle assembly and deposition chambers, enabling process capabilities for next-generation semiconductor, photonic, and sensing systems.

Gap Fill

By combining electrophoretic deposition with supercritical drying, ultra-high aspect ratio vias can be filled with a wide array of non-plateable materials.

Deterministic Assembly

By combining electrophoretic forces, dielectrophoretic forces, and supercritical drying nanoparticles can be deterministically assembled across a full wafer simultaneously.

Nanoparticle Deposition

Electrophoretic nanoparticle thick film and uniform micro-bump deposition coupled with in-situ supercritical drying to prevent cracking and enhance densification.